Feature Capability
Quality Grade Standard IPC 2
Number of Layers 1 - 32layers
Order Quantity 1pc - 10,000,000 pcs
Build Time 2days - 5weeks (Expedited Service)
Material FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg
Board Size Min 6*6mm | Max 600*700mm
Board size tolerance ±0.1mm - ±0.3mm
Board Thickness 0.4mm - 3.2mm
Board Thickness Tolerance ±0.1mm - ±10%
Copper Weight 0.5oz - 6.0oz
Inner Layer Copper Weight 0.5oz - 2.0oz
Copper Thickness Tolerance +0μm +20μm
Min Tracing/Spacing 3mil/3mil
Solder Mask Sides As per the file
Solder Mask Color Green, White, Blue, Black, Red, Yellow
Silkscreen Sides As per the file
Silkscreen Color White, Blue, Black, Red, Yellow
Surface Finish HASL - Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG - Electroless Nickle/Immersion Gold - RoHS
ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP -Organic Solderability Preservatives - RoHS
Min Annular Ring 3mil
Min Drilling Hole Diameter 6mil, 4mil-laser drill
Min Width of Cutout (NPTH) 0.8mm
NPTH Hole Size Tolerance ±.002" (±0.05mm)
Min Width of Slot Hole (PTH) 0.6mm
PTH Hole Size Tolerance ±.003" (±0.08mm) - ±.006" (±0.15mm)
Surface/Hole Plating Thickness 20μm - 30μm
SM Tolerance (LPI) .003" (0.075mm)
Aspect Ratio 1.10 (hole size: board thickness)
Test 10V - 250V, flying probe or testing fixture
Impedance tolerance ±5% - ±10%
SMD Pitch 0.2mm(8mil)
BGA Pitch 0.2mm(8mil)
Chamfer of Gold Fingers 20, 30, 45, 60
Other Techniques Gold fingers
Blind and Buried Holes
peelable solder mask
Edge plating
Carbon Mask
Kapton tape
Countersink/counterbore hole
Half-cut/Castellated hole
Press fit hole
Via tented/covered with resin
Via plugged/filled with resin
Via in pad
Electrical Test