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In general, the distribution of copper foil on the PCB circuit board is very complicated and difficult to accurately model. Therefore, the shape of the wiring needs to be simplified during modeling, and the electronic components on the ANSYS model circuit board that are close to the actual circuit board can also be simulated by simplified modeling, such as MOS tubes, integrated circuit blocks, etc.

1. Thermal analysis

Thermal analysis in SMT processing can assist designers in determining the electrical properties of components on PCB circuit boards, and help designers determine whether components or circuit boards will burn out due to high temperatures. The simple thermal analysis only calculates the average temperature of the circuit board, and the complicated one needs to establish a transient model of the electronic device with multiple circuit boards. The accuracy of thermal analysis ultimately depends on the accuracy of component power consumption provided by the circuit board designer.

In many applications, weight and physical size are very important. If the actual power consumption of the component is small, the safety factor of the design may be too high, so that the circuit board design uses the power consumption value of the component that does not match the reality or is too conservative. Perform thermal analysis. The opposite (and more serious) is that the thermal safety factor is designed to be too low, that is, the temperature of the component during actual operation is higher than that predicted by the analyst. Such problems generally need to install heat sinks or fans to the circuit board. Cool down to solve. These external accessories increase the cost and extend the time. Adding a fan to the design will also bring unstable factors to the reliability. Therefore, the circuit board mainly adopts active rather than passive cooling methods (such as natural convection, conduction and radiation heat dissipation).

2. Simplified modeling of circuit boards

Before modeling, analyze the main heating components in the circuit board, such as MOS tubes and integrated circuit blocks, etc. These components convert most of the power loss into heat during operation. Therefore, these devices are mainly considered when modeling. To

In addition, consider the copper foil coated on the circuit board substrate as a wire. They not only play the role of conducting electricity in the design, but also play the role of conducting heat. Their thermal conductivity and heat transfer area are relatively large. Circuit boards are an indispensable part of electronic circuits. Its structure is made of epoxy resin substrate. It is composed of copper foil coated as a wire. The thickness of the epoxy resin substrate is 4 mm, and the thickness of the copper foil is 0.1 mm. The thermal conductivity of copper is 400W/(m°C), while the thermal conductivity of epoxy is only 0.276W/(m°C). Although the added copper foil is very thin and thin, it has a strong guiding effect on heat, so it cannot be ignored in modeling. To

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