Standard PCB
| Feature | Capability |
|---|---|
| Quality Grade | Standard IPC 2 |
| Number of Layers | 1 - 32layers |
| Order Quantity | 1pc - 10,000,000 pcs |
| Build Time | 2days - 5weeks (Expedited Service) |
| Material | FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg |
| Board Size | Min 6*6mm | Max 600*700mm |
| Board size tolerance | ±0.1mm - ±0.3mm |
| Board Thickness | 0.4mm - 3.2mm |
| Board Thickness Tolerance | ±0.1mm - ±10% |
| Copper Weight | 0.5oz - 6.0oz |
| Inner Layer Copper Weight | 0.5oz - 2.0oz |
| Copper Thickness Tolerance | +0μm +20μm |
| Min Tracing/Spacing | 3mil/3mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Silkscreen Color | White, Blue, Black, Red, Yellow |
| Surface Finish |
HASL - Hot Air Solder Leveling Lead Free HASL - RoHS ENIG - Electroless Nickle/Immersion Gold - RoHS ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS Immersion Silver - RoHS Immersion Tin - RoHS OSP -Organic Solderability Preservatives - RoHS |
| Min Annular Ring | 3mil |
| Min Drilling Hole Diameter | 6mil, 4mil-laser drill |
| Min Width of Cutout (NPTH) | 0.8mm |
| NPTH Hole Size Tolerance | ±.002" (±0.05mm) |
| Min Width of Slot Hole (PTH) | 0.6mm |
| PTH Hole Size Tolerance | ±.003" (±0.08mm) - ±.006" (±0.15mm) |
| Surface/Hole Plating Thickness | 20μm - 30μm |
| SM Tolerance (LPI) | .003" (0.075mm) |
| Aspect Ratio | 1.10 (hole size: board thickness) |
| Test | 10V - 250V, flying probe or testing fixture |
| Impedance tolerance | ±5% - ±10% |
| SMD Pitch | 0.2mm(8mil) |
| BGA Pitch | 0.2mm(8mil) |
| Chamfer of Gold Fingers | 20, 30, 45, 60 |
| Other Techniques |
Gold fingers Blind and Buried Holes peelable solder mask Edge plating Carbon Mask Kapton tape Countersink/counterbore hole Half-cut/Castellated hole Press fit hole Via tented/covered with resin Via plugged/filled with resin Via in pad Electrical Test |