|
Feature |
Capability |
|
Base material |
PI 、FR4、 PET Cu |
|
Flexible Insulator |
PI : 1/2mil(12.5um)to 5mil (127um) |
|
Pet: 1/2mil(12.5um)to 5mil (127um) |
|
Conductor |
(Copper) |
|
Rolled Annealed (RA) |
|
Electrodeposited (ED)) |
|
Thickness: 1/3oz(12um) to 6 oz(200um) |
|
Adhesive |
Acrylic Adhesive: 1/2mil(12.5um) to 3mil (760um) |
|
Adhesiveness Materials |
|
Solder Mask |
PI / PET |
Covered in layers PI and PET film |
|
Resist Oil |
Solder Mask resist oil ) |
|
Thickness:12-18um |
|
Color(Green,Black,Yellow,White) |
|
Stiffener |
PI PET thickness:0.075-0.3mm |
|
FR4(thickness): 0.2-3mm |
|
Steel thicknes: 0.075-0.5mm |
|
Rigid - Flexible |
PI+FR4 (thickeness): 3 to 125mil |
|
Surface Finish |
Tin |
Immersion Tin |
|
Gold |
Immersion Gold tickness: 0.025-0.05um |
|
Electrolytic Hard Gold thickness:>0.05um |
|
Silver |
Immersion Silver |
|
OSP |
Organic Solerability Preservative |
|
Shielding |
Black Electromagnetic Film, Required to limit Electromagnetic and/or Electrostatic |
|
Impedance |
Impedance tolerance:+/-10% |
|
Layers |
1to 8 layers(Flexbile,Rigid-Flexible) |
|
Product Size |
Max. Size:1420*400mm |
|
Min. Size:2.5*2.5mm |
|
Outline tolerance |
Hand Tirm tolerance:+/-0.2mm |
|
Cutter Dies tolerane:+/-0.2mm |
|
Punch Dies tolerance:+/-0.075mm |
|
Laser Cut tolerance:+/-0.05mm |
|
Min. hole dimension |
Drilling(P.T.H) |
Machine Drilling: ￠0.15mm |
|
Laser Drilling: ￠0.05mm |
|
Punching |
￠0.50mm |
|
Tolerance of PTH |
±0.05mm |
|
Conductor |
Min. Width |
(Min. width): 1.5mil Tolerance:+/-15% |
|
Min. Spacing |
(Min. Spacing): 1.5mil Tolerance:+/-15% |
|
Pad |
Min. Pad: 0.25mm |
|
Stiffener Holes |
Min. stiffener Holes: 0.2mm |
|
Peeling strength |
1.0KGf/CM 0.5KGf/CM |
